Product Introduction:
Tungsten sputtering targets can form tungsten coatings on various substrates through magnetron sputtering technology, which are thin film transistor
components used in TFT-LCD screens. Due to its higher melting point than molybdenum, tungsten is more stable and suitable for large screens, meeting
the needs of higher image clarity and contrast. Product features:
(1) Ultra high density
High density target materials have high sputtering efficiency and can increase the sputtering area per unit time. We achieve almost 100% density of tungsten
target material through large rolling deformation, with a density of 19.3g/cm3, which can greatly avoid particle splashing caused by sudden release of pores
in the solid, thereby improving the quality of the thin film.
(2) Fine and uniform grain size
For the same target material, the sputtering rate is faster when the grain size is small; The thickness distribution of the sputtered deposited thin film is uniform.
The target material we produce through special processes has a small and uniform grain size, with a grain size of approximately 50 um in the vertical rolling
direction and less than 100 um in the rolling direction.
(3) Wide selection of target material types
We can provide you with many types of tungsten sputtering targets, which can be divided into tungsten square targets, tungsten bar targets, and tungsten tube
targets according to their shapes. According to material classification, it can be divided into pure tungsten targets and tungsten alloy targets.
2、Specifications
Specifications | Thickness (mm) | Width (mm) | Length(mm) |
Planar target | 10~18 | 200~300 | ≤4000 |
≤2100 | ≤3000 | ||
Rotating target | >φ100 | ≤2900 |
3、Product application
Tungsten sputtering targets can be used to manufacture thin film transistors for TFT-LCD screens, as well as for microelectronic components such as
frequency filters. Tungsten alloy targets can be used in applications such as CIGS thin film solar cells and electrochromic glass.
4、Technology