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Products > W-Cu Alloy
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W-Cu Alloy

Due to the immiscibility of tungsten and copper, tungsten copper alloys have the low expansion, wear resistance, corrosion resistance of tungsten, as well as the high conductivity and thermal conductivity of copper, and are suitable for various mechanical processing.
Therefore, tungsten copper alloy has the characteristics of high strength, high density, high temperature resistance, arc erosion resistance, good conductivity and electric heating performance, good processing performance, good arc breaking performance, good conductivity, good thermal conductivity, small thermal expansion, and sweating cooling.

1、Typical properties of tungsten copper composite materials

GradeChemical composition(wt%)DensityHardnessCoefficient of thermal expansionThermal conductivityElectrical resistivityConductivityBending strength
CuTotal impuritiesWg·cm-3HB15～800℃W(m·K)-1μΩ·cm%IACSMPa
W50Cu5050±2.0≤0.5balance≥11.85≥100 ≤13.3≥290≤3.2≥54--
W55Cu4545±2.0≤0.5balance≥12.30≥110 ≤12.4≥270≤3.5≥49--
W60Cu4040±2.0≤0.5balance≥12.75≥130 ≤11.6≥250≤3.7≥47--
W65Cu3535±2.0≤0.5balance≥13.30≥140 ≤10.4≥230≤3.9≥44--
W70Cu3030±2.0≤0.5balance≥13.80≥160 ≤9.4≥220≤4.1≥42≥790
W75Cu2525±2.0≤0.5balance≥14.50≥180 ≤8.4≥200≤4.5≥38≥885
W80Cu2020±2.0≤0.5balance≥15.15≥197 ≤7.7≥180≤5.0≥34≥980
W85Cu1515±2.0≤0.5balance≥15.90≥240 ≤7.2≥170≤5.7≥30≥1080
W90Cu1010±2.0≤0.5balance≥16.75≥260 ≤6.7≥160≤6.5≥27≥1160
W93Cu76月9日≤0.5balance≥17.00≥280 ≤6.4≥140≤6.5≥27--

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2、Technology

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3、Application

Tungsten copper material combines the low thermal expansion rate of tungsten with the high thermal conductivity of copper, which can effectively release 

the heat of electronic devices and help cool various products such as IGBT modules, RF power amplifiers, LED chips, etc. It can be used in large-scale 

integrated circuits and high-power microwave devices as insulation metal substrates, thermal control boards, heat dissipation components (heat sink materials), 

and lead frames.

（1）Electronic device heat dissipation devices.

（2）High performance lead frame.

（3）The thermal control panel and radiator of the thermal control device.

（4）High power devices such as microwave, laser, radio frequency, and optical communication.


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